note: pins 1 & 2 must be electrically connected at the printed circuit board. ds30255 rev. 9 - 2 1 of 3 SBM1040 www.diodes.com diodes incorporated SBM1040 10a low vf schottky barrier rectifier powermite 3 features single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. mechanical data b c d e g j h k l m a p 12 3 pin 1 pin 2 pin 3, bottomside heat s ink c characteristic symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 40 v rms reverse voltage v r(rms) 28 v average rectified output current (see also figure 4) i o 10 a non-repetitive peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) @t c = 88 c i fsm 150 a typical thermal resistance junction to soldering point r js 2.5 c/w operating temperature range t j -65 to +150 c storage temperature range t stg -65 to +150 c guard ring die construction for transient protection low power loss, high efficiency high surge capability high max junction temperature rating low forward voltage drop very low leakage current for use in low voltage, high frequency inverters, free wheeling, and polarity protection applications t c u d o r p w e n maximum ratings @ t a = 25 c unless otherwise specified electrical characteristics @ t a = 25 c unless otherwise specified characteristic symbol min typ max unit test condition reverse breakdown voltage (note 1) v (br)r 40 v i r = 1ma forward voltage (note 1) v f 0.45 0.47 0.49 0.41 0.51 v i f = 8a, t s = 25 c i f = 8a, t s = 125 c i f = 10a, t s = 25 c reverse current (note 1) i r 0.1 12.5 0.3 25 ma t s = 25 c, v r = 35v t s = 100 c, v r = 35v total capacitance c t 700 pf f = 1.0mhz, v r = 4.0v dc notes: 1. short duration test pulse used to minimize self-heating effect. case: powermite 3, molded plastic plastic material: ul flammability classification rating 94v-0 moisture sensitivity: level 1 per j-std-020a terminals: solderable per mil-std-202, method 208 polarity: see diagram weight: 0.072 grams (approx.) marking information: see sheet 3 powermite 3 dim min max a 4.03 4.09 b 6.40 6.61 c .864 .914 d 1.83 nom e 1.10 1.14 g .173 .203 h 5.01 5.17 j 4.37 4.43 k .173 .203 l .71 .77 m .36 .46 p 1.73 1.83 all dimensions in mm
ds30255 rev. 9 - 2 2 of 3 SBM1040 www.diodes.com 0 100 200 300 400 600 500 i , instantane o us f o rward current (a) f v , instantaneous forward voltage (mv) f fig. 1 typical forward characteristics 10 1 0.1 0.01 100 t = +25 c a t = +75 c a t=+150 c a 0 5 10 15 20 25 30 40 35 i , instantane o us reverse current ( m a) r v , instantaneous reverse voltage (v) r fig. 2 typical reverse characteristics t = +25oc a t = +150oc a t = +100oc a t = +75oc a 100 10 1 0.1 0.01 1000 100 1000 10,000 015 10 25 30 35 20 40 c,t o tal capacitance (pf) t v , reverse voltage (v) r fig. 3 typical total capacitance vs. reverse voltage 5 f=1mhz t c u d o r p w e n 0 2.5 5.0 7.5 12 .5 10.0 0 25 50 75 100 125 150 i , dc forward current (a) f t , ambient temperature (c) a fi g . 4 dc forward current deratin g note 2 note 3 note 4 notes: 2. t a = t soldering point , r js = 2.5 c/w, r sa = 0 c/w. 3. device mounted on getek substrate, 2?x2?, 2 oz. copper, double-sided, cathode pad dimensions 0.75? x 1.0?, anode pad dimensions 0.25? x 1.0?. r ja in range of 15-30c/w. 4. device mounted on fr-4 substrate, 2?x2?, 2 oz. copper, single-sided, pad layout as per diodes inc. suggest ed pad layout document ap02001 which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. r ja in range of 60-75c/w.
ds30255 rev. 9 - 2 3 of 3 SBM1040 www.diodes.com 0 1 2 3 5 4 6 7 8 0 1.5 4.5 3 6 7.5 9 10.5 12 13.5 15 p , average forward power dissipation (w ) f(av) i , average forward current (a) f(av) fi g . 5 forward power dissipation t = 150c j dc note 6 note 5 t c u d o r p w e n ordering information (note 10) device packaging shipping SBM1040-13 powermite 3 5000/tape & reel SBM1040 = product type marking code = manufacturers? code marking yyww = date code marking yy = last two digits of year ex: 02 for 2002 ww = week code 01 to 52 (k) = factory designator yyww(k) SBM1040 notes: 10. for packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. notes: 5. maximum power dissipation when device mounted on getek substrate, 2?x2?, 2 oz. copper, double-sided, cathode pad dimensions 0.75? x 1.0?, anode pad dimensions 0.25? x 1.0?. r ja in range of 15-30c/w. 6. maximum power dissipation when device mounted on fr-4 substrate, 2?x2?, 2 oz. copper, single-sided, pad la yout as per diodes inc. suggested pad layout document ap02001 which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. r ja in range of 60-75c/w. 7. r ja = 15c/w when mounted on 2"x2", single-sided, ceramic board with cathode pad dimensions 0.75"x1.0", anode pad dimensions 0.25"x1.0". 8. r ja = 30c/w when mounted on 2"x2", single-sided, fr-4 board with cathode pad dimensions 0.5"x1.0", anode pad dimensions 0.5"x1.0", 2 oz. copper pads. 9. r ja = 90c/w when mounted on 0.5"x0.625", single-sided, fr-4 board with minimum recommended pad layout. powermite is a registered trademark of microsemi corporation. 60 80 70 160 150 140 130 120 110 100 90 0 10 20 30 40 t , derated ambient temperature (c) a v , dc reverse voltage (v) r fi g . 6 operatin g temperature deratin g note 9 note 7 note 8 marking information
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